10-Layer Rigid PCB for Active Antenna Applications

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A 10-layer rigid PCB can provide the multilayer structure and high-frequency performance required for active antenna and RF applications. This 10-layer rigid high-frequency PCB is designed for a frequency range of 500 MHz to 6 GHz, making it suitable for RF and wireless communication devices.

The board uses a combination of FR4-S1000-2M and ceramic RO4350B materials and adopts mechanical blind via technology to support high-frequency signal transmission and stable board performance.

Key Specifications

The main specifications of this 10-layer rigid PCB include:

• Board Type: 10-layer rigid PCB

• Material: FR4-S1000-2M + ceramic RO4350B

• Complete Plate Thickness: 2.0 mm

• Line Width/Space: 4/4 mil

• Surface Finish: ENIG 2 μ"

• Frequency Range: 500 MHz–6 GHz

• Via Technology: Mechanical blind vias

High-Frequency PCB for Active Antennas

Active antenna systems require PCBs that can handle high-frequency signals while maintaining stable electrical performance. The 10-layer structure provides multiple layers for routing and circuit integration, while the use of ceramic RO4350B helps meet the requirements of high-frequency applications.

The PCB is designed for frequencies from 500 MHz to 6 GHz, covering a range of RF and wireless communication applications.

Mechanical Blind Via Technology

The PCB uses mechanical blind vias, which connect selected outer and inner layers without passing through the entire board.

This structure can help optimize multilayer routing and support compact high-frequency circuit designs. It is particularly useful when space and signal routing are important considerations in RF and wireless communication equipment.

Applications

With its 10-layer rigid structure, high-frequency material combination, and 500 MHz to 6 GHz operating range, this PCB is suitable for applications such as:

• Active antenna systems

• RF devices

• Wireless communication equipment

• High-frequency electronic devices

For applications requiring multilayer routing and high-frequency signal transmission, the board provides a combination of rigid construction, fine 4/4 mil line width and spacing, and mechanical blind via technology.

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Shenzhen EsionPCBA Technology Co., Ltd.